This two-part epoxy resin adhesive is designed for room temperature curing, offering strong shear strength and durability at temperatures up to 400°F (205°C). The smooth, brushable paste cures to handling strength overnight and can be accelerated with elevated temperatures, making it easy to apply for various bonding applications.
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WARNING: This product can expose you to chemicals including CERAMIC FIBERS (AIRBORNE PARTICLES OF RESPIRABLE SIZE) and GLASS WOOL FIBERS (INHALABLE AND BIOPERSISTENT) which is [are] known to the State of California to cause cancer. For more information go to www.P65Warnings.ca.gov.
Overview
ResinLab® Armstrong™ A-661 is a two-part room temperature curing adhesive that produces bonds with excellent shear strength and will maintain its performance after long-term exposure to temperatures up to 400 deg F/205 deg C. Armstrong A-661 is a smooth, brushable, non-sag, easy-to apply paste that cures to handling strength overnight at room temperature. An elevated cure schedule at or above 165 deg F (75 deg C), for example 10 min at 150 deg C, can be used to accelerate final properties.
Specifications
Container Size: 48 g
Container Type: Jar
Color: Gray
Composition: 10 to 30% Aluminum, 10 to 30% Epoxy Resin, 10 to 30% Tetraglycidyl-4, 4'-Methylene Dianiline, 5 to 10 2, 2-Bis(4-Hydroxycyclohexyl)Propane, Epichlorohydrin Polymer
Form: Liquid
Applicable Materials: Aluminum, Steel, Other Metals, Most Plastics, Ceramic and Wood
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Product information provided "as is", and Boeing may add, change, discontinue or remove product information at any time. Product photos may not be exact match to product delivered. Seeterms & conditions.
