Huntsman Advanced Materials® ResinLab® Armstrong™ A-661 Glycol Epoxy Adhesive Paste Off-White 1 Gal EPC1618DBBGL

ResinLab® Armstrong™ A-661 is a two-part room temperature curing adhesive that produces bonds with excellent shear strength and will maintain its performance after long-term exposure to temperatures up to 400 deg F/205 deg C. Armstrong A-661 is a smooth, brushable, non-sag, easy-to apply paste that cures to handling strength overnight at room temperature. An elevated cure schedule at or above 165 deg F (75 deg C), for example 10 min at 150 deg C, can be used to accelerate final properties.

TECHNICAL INFORMATION
• FAA-NR Approved

SPECIFICATIONS
• Container Size: 1 gal
• Color: Off-White
• Composition: 25 to 30% Bisphenol A Epoxy Resin, 10 to 20% O-Cresyl Glycidyl Ether, 5 to 10% Epoxy Phenol Novolac Resin, 5 to 10% 2, 2 Bis(Acryloyloxymethyl)Butyl Acrylate, 2.5 to 5% Dimethyl Methylphosphonate, 1 to 2.5% Siloxanes and Silicones, Di-Me, 3 Hydroxypropyl Me, Ethoxylated, 0.1 to 0.25 Ethylbenzene( Part 1618D) >=3 to <=7% Monoethanolamine, >=30 to <=60% 4, 4'-Isopropylidenediphenol, >=30 to <=60% Diethylenetriamine, >=13 to <=30 2, 2'-Dimethyl-4, 4'-Methylenebis(Cyclohexylamine)
• Boiling point: >200 deg C
• Curing Time: 7 Days at Rt, 5 hr at 125 deg F
• Flash Point: >100 deg C
• Form: Paste
• Mixing Ratio: 100:14
• Odor/Scent: Slight
• Shelf Life: 180 Days
• Tensile Strength: 5000 psi at 77 deg F (Compressive)
• Viscosity: 400 mPa-s
• Vapor pressure: <1 hPa
• Suitable for Use With: Boeing BMS 5-28, Type 18, Class 1
• Domestic/Import: Domestic

APPLICATIONS
• Reinforcing Honeycomb Composite Panels in Aircraft Floors
• Galley Walls
• Overhead Bins
• Bulkheads and More