Huntsman Epibond® Epoxy Paste, Soft Paste (Part A), Liquid (Part B), Amine-Like (Part B), 1 qt

Epibond® 156-A/B epoxy paste is a white compound developed primarily for smoothing the porous surfaces of plastics, wood or metal. Epibond® 156-A/B epoxy paste has good adhesion, low shrinkage and can be easily applied with a spatula, splining tools or polyethylene squeegees. This product is ideal as a wipe on paste for filling porosity on the surface of laminated composite structures such as radomes, edge joints, surfaces or polystyrene foam.
Features
• Room temperature cure
• Good electrical properties
Specifications
• Container Size: 1 qt
• Form: Soft Paste (Part A), Liquid (Part B)
• Color: Amber/Off-White (Part B/A)
• Odor/Scent: Amine-Like (Part B)
• pH Value: 11.3 (Part B)
• Composition: 30 to 60% Mica, 1 to 5% Titanium Dioxide, 30 to 60% Phenol. 4.4-(I-Methylethylidene)Bis-, Polymer with (Chloromethy)Oxirane Bisphenol-A Epoxy Resin, 1 to 5% 1,2-Betizenedicarboxylic Acid Dibutyl Ester Dibutyl Phthalate (Part A), 60 to 100% Diethylenetnamine, 0.1 to 1% 2-Piperazine-1 -Yiethylamine (Part B)
• Flash Point: 360 deg F (Part A), 212 deg F (Part B)
• Boiling Point: 404.6 deg F (Part B)
• Melting Point: -38.2 deg F (Part B)
• Freezing Point: -38.2 deg F (Part B)
• Density: 1.54 g/cc (Part A), 0.95 g/cc (Part B)
• Viscosity: 325000 cPs (Part A), 5 to 9 cPs (Part B)
• Specific Gravity: 1.5 (Part A), 0.952 (Part B)
• Base Type: Epoxy
• Vapor Density: >1 (Part A)
• Vapor Pressure: <1 mmHg (Part A), 0.075 mmHg (Part B)
• Evaporation Rate: <1 (Part A)
• Curing Time: 3 days at 77 deg F
• Shelf Life: 12 months