Huntsman EP0CST1636GL Glycol Epoxy Adhesive, 1 gal, Pourable, Gray, Slight

ResinLab® Armstrong™ A-661 is a two-part room temperature curing adhesive that produces bonds with excellent shear strength and will maintain its performance after long-term exposure to temperatures up to 400 deg F/205 deg C. Armstrong A-661 is a smooth, brushable, non-sag, easy-to apply paste that cures to handling strength overnight at room temperature. An elevated cure schedule at or above 165 deg F (75 deg C), for example 10 min at 150 deg C, can be used to accelerate final properties.

TECHNICAL INFORMATION
• FAA-NR Approved

SPECIFICATIONS
• Container Size: 1 gal
• Color: Gray
• Composition: 13 to 30% Bisphenol A, Epoxy Resin, 7 to 13% Epoxy Phenol Novolac Resin, 3 to 7% Butanedioldiglycidyl Ether (Part A), 30 to 60% Triethylenetetramine, 13 to 30% N, N-[1, 7-Heptanediylbis[(4, 5-Dihydro-1H-Imidazole-2, 1-Diyl)-2, 1-Ethanediyl]]bis1, 2-Ethanediamine, 7 to 13% Metaxylenediamine, 3 to 7% 1-Methylimidazole (Part B)
• Curing Time: 7 Days at 77 deg F, 1 hr at 350 deg F
• Flash Point: >137 deg C (Part A), >118 deg C (Part B)
• Form: Pourable
• Mixing Ratio: 100:8
• Odor/Scent: Slight
• Setting Time: 120 min at 77 deg F
• Shelf Life: 365 Days
• Temperature Rating: 350 deg F
• Tensile Strength: 15000 psi at 77 deg F (Compressive)
• Viscosity: 29000 cPs
• Domestic/Import: Domestic

APPLICATIONS
• Reinforcing Honeycomb Composite Panels in Aircraft Floors
• Galley Walls
• Overhead Bins
• Bulkheads and More