EPOXY: CONDUCTIVE, CHO-BOND 360-20 KIT

CHO-BOND 360 compound is a relatively low cost, electrically conductive epoxy adhesive that combines the good adhesive characteristics as epxoy, and the superior electical conductivity of silver. It is recommended as a thermo-setting EMI-RFI shielding compound and is effective even for designs requiring the use of a fillet as opposed to a flanged bead (with hardner 208). CHO-BOND 360 compound is excellend for poorly toleranced, non-flat surfaces which have been coated with a thin dielectric layer, such as Class 1 irridite or alodine. Chormerics recommends MIL-C-5541B, Class 3 when low electrical resistance and corrosion resistance are required. Its coarse granular silver plated copper filler will abrade thin oxides from aluminum, copper and galvanized steel, especially when applied between flanges under modest contact pressure.



CHO-BOND 360-20 conductive adhesive is the lowest cost version, easiest to mix with a 1:1 mix ratio. It is the most conductive, has the highest lap shear bond strength. I may be cured at room temperature. It fills large gaps, has good thermal shock resistance. It is the more versatile of the two CHO-BOND 360 systems and has a one hour pot life. CHO-BOND 360-20 shields most effectively when used between flanges having a contact pressure of 15 psi or better.