Parker® CHO-BOND® 2165 Electrically Conductive Sealant, Polyurethane, Liquid, 454 g Bottle/Can

CHO-BOND® 2165 is a stabilized-copper filled, two component polyurethane conductive sealant specifically designed for aerospace and military applications. CHO-BOND® 2165 provides a conductive, corrosion-resistant protective compound for aluminum and composite airframes used in conjunction with Parker Chomerics CHO-SHIELD 2000 Series EMI coatings. CHO-BOND® 2165 is a good compound choice for EMI shielding and electrical grounding applications. This thick conductive paste may be used as fastener fill, gap fill or repair compound for aircraft. CHO-BOND® 2165 achieves full properties in less than 4 hours with a combination room temperature cure plus a 113 degrees C cure minimizing aircraft downtime. Due to material shrinkage, multiple applications may be necessary.
Features
• Working life doesn't start until the two components are mixed
• Excellent conductivity 0.010 Ohm-centimeter, very good corrosion resistance, survives 2000 hours in salt spray (MIL-STD-810) against a 6060-T6 aluminum substrate with a MIL-DTL-5541, Type II, Class 3 chromate
• Can be used on overhead or vertical surfaces, environmentally friendly
Specifications
• Container Type: Bottle/Can
• Container Size: 454 g
• Base Type: Polyurethane
• Form: Liquid
• Color: Brown/Clear Yellow (Part A/B)
• Odor/Scent: Solvent
• Composition: 65 to 70% Copper, 1 to 5% Silver, 3 to 7% Xylene, 1 to 2% Aromatic Triazole, 0.5 to 1.5% n-Butyl Acetate (Part A), 65 to 85% Hexamethylene Diisocyanate, Oligomer, 10 to 20% n-Butyl Acetate, 7 to 13% Xylene, 0.1 to 0.6% Hexamethylene Diisocyanate, 0.1 to 0.5% Ethylbenzene (Part B)
• Specific Gravity: 2.75 (Part A), 1.06 (Part B)
• VOC Content: 200.4 g/L (Part A), 286 g/L (Part B)
• Coverage Area: 900 sq-in
• Shelf Life: 274 days
• Flash Point: 29 deg C (Part A), 32.8 deg C (Part B)
• Boiling Point: >137 deg C (Part A), >126 deg C (Part B)
• Temperature Rating: -65 to 85 deg C
• Curing Time: 2 hr at 21 deg C