Parker® CHO-BOND 1038TB Conductive Silicone Sealant, Tube, 1.5 oz, Medium Paste, Gray, Mild

CHO-BOND 1038 is a silver-plated copper-filled, one-component conductive silicone. It is designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding. Minimum recommended bond line for CHO-BOND 1038 is 0.007 in (0.18 mm). In addition, CHO-BOND 1038 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (less than 150 psi) is required. CHO-BOND 1038's moisture cure silicone polymer system allows it to cure to the touch in 24 hr and provides a robust conductive and environmental seal over a wide range of application temperatures. For applications requiring zero volatile organic compounds (VOCs) or minimal shrinkage, Parker Chomerics offers a solvent-free version of CHO-BOND 1038 called CHO-BOND 1121. For best adhesion results, CHO-BOND 1038 should be used in conjunction with CHO-BOND 1086 primer. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters.

FEATURES
• One-component
• Silver-plated copper filler
• Moisture cure silicone
• Non-corrosive cure mechanism
• Medium paste
• No VOCs version CHO-BOND 1121
• Easy-to-use, no weighing or mixing required
• Excellent conductivity 0.01 ohm-cm
• 30 min work life, rapid skin formation, 24 hr handling time, requires no pressure during curing, wide range of application temperatures
• 1 week for full cure
• No corrosive by-products generated during curing to damage substrate
• Easy-to-dispense, apply and spread, can be used on overhead or vertical surfaces
• Minimal shrinkage, no permits or ventilation required

TECHNICAL INFORMATION
• ASTM D792 Specified
• ASTM-D2240 Specified

SPECIFICATIONS
• Container Size: 1.5 oz
• Container Type: Tube
• Color: Gray
• Form: Medium Paste
• Odor/Scent: Mild
• Composition: 65 to 80% Copper, 10 to 20 Polydimethylsiloxane, 5 to 10 Silver, 1 to 5 Xylene, 0.4 to 1.2 Trimethoxymethylsilane, 0.5 to 1.5 Ethylbenzene, <0.2% Methanol
• Boiling point: 216 deg F
• Flash Point: 200 deg F
• Specific Gravity: >1
• Temperature Rating: -55 to 125 deg C
• VOC Content: 111 g/L
• Shelf Life: 183 Days
• Relative density: >1
• Shear Strength: 1034 kPa
• Durometer: 80
• Coverage Area: 775 sq-in
• Hardness: 80 Shore A
• Domestic/Import: Domestic

APPLICATIONS
• Man-Portable Electronics
• Radar and Communication Systems
• Emi Vents
• Military Ground Vehicles and Military Shelters Applications