Ellsworth Adhesives Resinlab® Armstrong™ A661 2-Part Epoxy Resin Adhesive, Jar, 48 g, Liquid, Gray

ResinLab® Armstrong™ A-661 is a two-part room temperature curing adhesive that produces bonds with excellent shear strength and will maintain its performance after long-term exposure to temperatures up to 400 deg F/205 deg C. Armstrong A-661 is a smooth, brushable, non-sag, easy-to apply paste that cures to handling strength overnight at room temperature. An elevated cure schedule at or above 165 deg F (75 deg C), for example 10 min at 150 deg C, can be used to accelerate final properties.

TECHNICAL INFORMATION
• FAA-NR Approved

SPECIFICATIONS
• Container Size: 48 g
• Container Type: Jar
• Color: Gray
• Composition: 10 to 30% Aluminum, 10 to 30% Epoxy Resin, 10 to 30% Tetraglycidyl-4, 4'-Methylene Dianiline, 5 to 10 2, 2-Bis(4-Hydroxycyclohexyl)Propane, Epichlorohydrin Polymer
• Form: Liquid
• Applicable Materials: Aluminum, Steel, Other Metals, Most Plastics, Ceramic and Wood
• Odor/Scent: Mild
• Curing Time: 24 hr
• Flash Point: >93.3 deg C
• Specific Gravity: 1.6
• Temperature Rating: -40 to 205 deg C
• Viscosity: 640000 cPs
• Shear Strength: 430 to 3460 lb
• Shelf Life: 270 Days
• Density: 1.19 g/cc
• Domestic/Import: Domestic