COMPOUND: POTTING,BLK,48.5ML, 3M SW DP270

3M™ Scotch-Weld™ epoxy potting compound DP270 is low-viscosity for easy dispensing and potting. It is non-corrosive to copper, minimal exotherm and very low shrinkage - making it well-suited for potting and bonding electronic and electrical components. When using a Duo-Pak (DP) size adhesive, rely on 3M™ dispensing equipment for convenient and accurate metering, mixing and dispensing.
Features
• Features a 70 minutes work life
• Rigid potting compound is non-corrosive to copper
• Minimal exothermic and very low shrinkage
• Flammability testing per UL94 HB
Specifications
• Capacity: 48.5 mL
• Color: Black
• Mixing Ratio: 1:1
• Mixed Work Life: 60 min at 75 deg F
• Time to Handling Strength: 3 hr at 75 deg F
• Floating Roller Peel: 3 hr PLI at 75 deg F
• Viscosity: 12000 cPs at 75 deg F
• Container Type: Duo-Pak Cartridge
• Overlap Shear: 1200 to 300 psi at -67 to 180 deg F
• Boiling Point: 401 deg F (Part A), >240 deg F (Part B)
• Composition: 40 to 60% Trade Secret 4-Nonylphenol, branched with isomers, 15 to 40% Trade Secret 4,4'-Methylenebis(2-methylcyclohexylamine), <10% Trade Secret 2-Nonylphenol, branched, 1 to 10% Trade Secret Benzyl Alcohol (Part A), 90 to 99% Trade Secret Epoxy Resin, 1 to 10% Trade Secret Hydrocarbon Resin, <=1% Trade Secret Carbon Black (Part B)
• Flash Point: >300 deg F (Part A), >200 deg F (Part B)
• Specific Gravity: 1 (Part A), 1.15 (Part B)
• Physical State: Liquid
• Density: 1 g/mL (Part A), 1.15 g/mL (Part B)