Epoxylite® 2-Part High-Temperature Adhesive Kit, Heat, 201 deg F, 30 min to 16 hr, 100:28, 1/2 pt

Epoxylite® E 5403 hi temp epoxy is a heat cured, two component system consisting of a viscous liquid resin and a finely divided powder hardener. It is provided in pre-measured kits.
Features
• Two component adhesive system applied as a heavy paste
• Suitable for edge filleting
• Glass transition temperature 220 degrees C
Specifications
• Container Size: 1/2 pt
• Composition: 48 to <49% Epoxy Resin, 22 to <23% Crystalline Silica, 20 to <21% Magnesium Silicate Talc, 3 to <4% Phenyl Glycidyl Ether, 2 to <3% Epoxy Resin (Part A), 82 to <83% Pyromellitic Dianhydride, 8 to <9% Crystalline Silica, 7 to <8% Magnesium Silicate Talc, 1 to <2% 1,2,4,5-Benzenetetracarboxylic Acid (Part B)
• Applicable Materials: Ceramic, Metal and Most Plastic
• Curing Method: Heat
• Flash Point: 201 deg F
• Curing Time: 30 min to 16 hr
• Density: 1.6120 g/cc (Part A), 1.7890 g/cc (Part B)
• Mixing Ratio: 100:28
• Form: Liquid (Part A), Paste (Part B)
• Viscosity: 22 sq-mm/s
• Temperature Rating: 600 deg F
• Shelf Life: 180 days
• Base Type: Epoxy
• Shear Strength: 400 to 1800 psi
• Volatile Volume: 0.2 lb/gal
• Compressive Strength: 40000 psi
• Flexural Strength: 10000 psi
• VOC Content: 0.2 lb/gal
• Dielectric Strength: 560 V/mil
• Volume Resistivity: 1 x 10 to the Power of 16 Ohm-cm