Parker® Epoxy Adhesive, Paste, Mild, Silver, -55 to 125 deg C, 11000 sq-in, 10 g

Parker Chomerics CHO-BOND® 584-29 conductive adhesive is a two component, silver-filled epoxy formulated for thin bond lines and where precise application is required. CHO-BOND® 584-29 is a silver colored epoxy designed to be used in very tight applications and around electrical components.
Features
• Silver filler is a premium conductivity solution to electrical bonding
• Excellent conductivity levels (0.002 ohm-com)
• Strong adhesion properties (>1200 PSI lap shear strength)
• Thin paste makes it effective for easy dispensing from a small needle for small cracks and voids
• Fast cure at elevated temperatures (15 minutes at 113 degrees C) and room temperature cure options
• Low VOC
• Comes in standard sizes of pre-measured syringes so no mixing and measuring is required
Specifications
• Container Size: 10 g
• Color: Silver
• Composition: 65 to 75% Silver, 20 to 30% Bisphenol A/Epichlorohydrin Resin, 5 to 8% o-Cresyl Glycidyl Ether
• Mixing Ratio: 100:63
• Form: Paste
• Coverage Area: 11000 sq-in
• Curing Time: 0.25 hr at 113 deg C, 2 hr at 65 deg C
• Odor/Scent: Mild
• Flash Point: >93.3 deg C
• Overlap Shear: 1200 psi
• Shear Strength: 1200 psi
• Shelf Life: 12 months
• Specific Gravity: 2.5
• Temperature Rating: -55 to 125 deg C
• VOC Content: 0 g/L
• Relative Density: >1
• Hardness Rating: 80 Shore D
• Working Life: 0.5 hr