This thermally conductive compound is designed for effective heat transfer in electronic applications. It features a non-curing, non-flowing silicone base filled with metal oxides, ensuring stability at high temperatures up to 177°C (350°F). The product helps maintain a reliable seal between devices and heat sinks, enhancing thermal performance.
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Overview
Dow Corning 340 Heat Sink Compound is a White, non-curing and non-flowing thermally conductive compound that are greaselike silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high temperature stability. The compounds resist changes in consistency at temperatures up to 177�C (350�F), maintaining a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. Long-term, reliable protection of sensitive circuits and components is important in many of today�s delicate and demanding electronic applications.
Features & Benefits
High thermal conductivity: Efficiently transfers heat from sensitive components to heat sinks, enhancing device efficiency
Non-curing, non-flowing: Remains in place without hardening or melting, ensuring a durable seal
Wide service temperature range: Stable consistency up to 350°F (177°C) for high-temperature environments
Low bleed: Minimizes oil separation, preventing contamination of nearby components
Electrically insulating: Safe for use near live circuits without risk of shorting
Easy application: Single-component formula suitable for manual or automated dispensing
Specifications Met: Compliant with MIL-DTL-47113 (formerly MIL-L-47113)
Applications: Thermal coupling of electrical/electronic devices to heat sinks or chassis; thermal coupler for aircraft engines; high-voltage corona suppressant and nonflammable coating in flyback transformer connections
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