This thermally conductive compound is designed for effective heat transfer in electronic applications. It features a non-curing, greaselike consistency that remains stable at high temperatures, ensuring a reliable seal between devices and heat sinks. The formulation includes metal oxides for enhanced thermal conductivity and reduced bleed.
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Overview
Dow Corning 340 Heat Sink Compound is a White, non-curing and non-flowing thermally conductive compound that are greaselike silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high temperature stability. The compounds resist changes in consistency at temperatures up to 177�C (350�F), maintaining a positive heat sink seal to improve heat transfer from the electrical/electronic device to the heat sink or chassis, thereby increasing the overall efficiency of the device. Long-term, reliable protection of sensitive circuits and components is important in many of today�s delicate and demanding electronic applications.
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