Huntsman Araldite® Two-Part Epoxy Adhesive, 200 mL Dual Barrel Cartridge
Huntsman Advance Materials
Part # ARALDT2014-200=CH
Hazmat
Forecastable
Hazmat
Forecastable
This two-part epoxy adhesive features high chemical and temperature resistance, curing at room temperature for durable bonds. Its cartridge design facilitates use in tight spaces, while low shrinkage ensures precision. Suitable for various applications, it effectively bonds materials like filter media, electronic components, and composite pipes in marine environments.This two-p
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Overview
Araldite® 2014 adhesive offers straightforward processability combined with high chemical and temperature resistance. Curing at room temperature, this adhesive enables a reliable and long-lasting bond with resistance to hydraulic oils and temperatures up to 284 degrees F. The cartridge format makes it easy-to-use in confined spaces and the low shrinkage rate allows for tight tolerances. This versatile adhesive is suited for a variety of applications including bonding filter media, electronic fuse assembly and bonding composite pipes for marine settings.
Features & Benefits
Resistant to chemicals, temperature-resistant
Low shrinkage rate
Specifications
Series: 2014 A/B
Container Size: 200 mL
Container Type: Dual Barrel Cartridge
Composition: <50% 2,2'-[(1-Methylethylidene)Bis(4,1-Phenyleneoxymethylene)]Bisoxirane, <20% Formaldehyde, Oligomeric Reaction Products with 1-Chloro2,3-Epoxypropane and Phenol, <3% 1,4-Bis(2,3-Epoxypropoxy)Butane, Reaction Mass of Bis(2,3-Epoxypropyl) Terephthalate and Tris(Oxiranylmethyl) Benzene1,2,4-Tricarboxylate(Part A), <50% Reaction Products of Fatty Acid Dimer and Trimers, C18, 10% 2,2,4(or 2,4,4)-Trimethylhexane1,6-Diamine, <10% Fatty Acid, C18-Unsatd., Dimer, Polymer with Oleic Acid and Triethylenetetramine, 5% N'-(3-Aminopropyl)-N,Ndimethylpropane-1,3-Diamine (Part B)
Viscosity: 92800 mPa-s (Part A), 75 to 150 Pas (Part B)
Shear Strength: 145 psi
Shelf Life: 1095 days
Temperature Rating: 140 deg C
Tensile Strength: 30 MPa
Density: 1.6 g/cc
Vapor Pressure: <1.33 hPa at 20 deg C (Part A), 0.001 hPa (Part B)
Technical Information
KIWA Approved
Application
For bonding of filter media to end cap assembly of electronic fuses bonding of composite pipes in marine potting of connectors bonding of railway insulation rods
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