Henkel Loctite® Hysol® EA 9460F Adhesive 83129, 50 mL dual cartridge
Henkel Loctite
Part # 83129=6P
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Mfr Part # 83129
Hazmat
Forecastable
Hazmat
Forecastable
This dual cartridge epoxy adhesive features a non-sag formula with a high impact resistance, requiring a 1:1 mixing ratio. It has a curing time of 72 hours, with application taking 40 to 65 minutes. The adhesive exhibits significant tensile and shear strength, and has low VOC content for quick evaporation.
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WARNING: This product can expose you to chemicals including SILICA, CRYSTALLINE (AIRBORNE PARTICLES OF RESPIRABLE SIZE) and TITANIUM DIOXIDE (AIRBORNE, UNBOUND PARTICLES OF RESPIRABLE SIZE) which is [are] known to the State of California to cause cancer. For more information go to www.P65Warnings.ca.gov.
Overview
Henkel Loctite® Hysol® EA 9460F non-sag epoxy adhesive is a high impact-resistant formula that contains two components such as white liquid resin and black paste hardener, which should be mixed in a 1:1 ratio by volume or weight. The slight ammoniacal hardener has a boiling point greater than 300.2 degrees F. Flash point of this adhesive is greater than 300.2 degrees F for resin and 199.4 degrees F for hardener. The resin has a viscosity of 150,000 to 300,000 centipoises whereas hardener has 100,000 to 250,000 centipoises. Both the resin and hardener having less than 10 grams per liter VOC contents evaporates quickly. This epoxy compound takes 72 hours for curing and requires 40 to 65 minutes for application. It withstands a tensile strength of 4400 psi and a shear strength of 3500 psi. This product comes in a 50-milliliter dual cartridge and has a specification gravity greater than 1 for resin and 1.31 for hardener. It comes with an elongation of 0.035. This adhesive has a storage temperature range of 8 to 21 degrees C.
Features & Benefits
Exhibits high peel strength and excellent shear strength characteristics
Flexibility of the cured adhesive makes it useful for bonding dissimilar substrates
Supports carbon dioxide, dry chemicals or water spray as extinguishing media
Used for bonding dissimilar substrates
Applicable on various ceramic, metals and plastic surfaces
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