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INTEGRATED CIRCUIT:,
Part # 55-0290-4-11=77 | Mfr Part # 55-0290-4-11 Forecastable
8130-3 Eligible
Forecastable
8130-3 Eligible
INTEGRATED CIRCUIT: Case Outline Source and Designator: To-116 Joint Electron Device Engineering CoUNCil Inclosure Configuration: Dual-In-Line Operating Temp Range: -55.0 To 125.0 Deg Celsius Body Length: 0.660 Inches Minimum and 0.785 Inches Maximum Terminal Type and Quantity: 14 Printed Circuit Design Function and Quantity: 4 Gate, Nand Inclosure Material: Ceramic Maximum Power Dissipation Rating: 34.0 Milliwatts Terminal Surface Treatment: Solder Output Logic Form: Diode-Transistor Logic Storage Temp Range: -65.0 To 150.0 Deg Celsius Body Width: 0.220 Inches Minimum and 0.280 Inches Maximum Voltage Rating and Type Per Characteristic: 8.0 Volts Maximum Power Source Input Circuit Pattern: Quad 2 Input Features Provided: Hermetically Sealed and Monolithic and Positive Outputs Body Height: 0.185 Inches Maximum
FSCG Category Microcircuits, Electronic
Harmonized Tariff Schedule Code DISCLAIMER: Product information provided “as is.” Boeing may add, change, discontinue or remove this information at any time. Product photos may not be exact match to product delivered. Seeterms & conditions .
